I-XDB102-3 Esabalalisiwe Inzwa Yokucindezela Kwe-Silicon Isithombe Esifakiwe

I-XDB102-3 Inzwa Yokucindezela Ye-Silicon Esabalalisiwe

Incazelo emfushane:

I-XDB102-3 series diffused silicon pressure sensor cores isebenzisa ukuzinza okuphezulu kwe-silicon chip, ingcindezi ephakathi nendawo ingadluliselwa kuma-silicon chips ngokusebenzisa i-diaphragm kanye nokudluliswa kukawoyela we-silicon ekusakazeni kwama-silicon chips, ukusetshenziswa kwe-diffused silicon piezo-resistive effect isimiso ukufeza inhloso yokulinganisa ubukhulu boketshezi, umfutho wegesi.

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Izici

● Ukuvumelana kwe-CE.

● Ibanga: -100kPa…0kPa~20kPa…3.5MPa.

● I-chip engenisiwe, Ukunquma i-Laser.

● Nikeza i-OEM, ukwenza ngendlela oyifisayo nezimo.

● φ19mm×5.55mm.

Izicelo Ezijwayelekile

● Ukulawulwa kwenqubo yezimboni.

● Ukutholwa kwengcindezi yegesi, uketshezi kanye nomhwamuko.

● Isilinganiso sezinga.

ukusetshenziswa ku-Hydraulic kanye nezinhlelo zokulawula umoya womoya

isilinganiso sokucindezela kwezimboni koketshezi lwegesi nesitimu

Isilinganiso sengcindezi yoketshezi lwegesi

Imingcele Yezobuchwepheshe

Isimo sesakhiwo
Impahla ye-diaphragm	I-SS 316L		Impahla yezindlu	I-SS 316L
Phina ucingo	I-karaf efakwe ngegolide/intambo yerabha ye-silicone eyi-100mm		Ishubhu yokucindezela emuva	I-SS 316L (igeji nokucindezela okunegethivu kuphela)
Indandatho yokuvala	Irabha ye-Nitrile
Isimo sikagesi
Ukunikezwa kwamandla kagesi	≤2.0 mA DC		Okokufaka kwe-impedance	2.5kΩ ~ 5 kΩ
Okukhiphayo kwe-Impedans	2.5kΩ ~ 5 kΩ		Impendulo	(10%～90%) :<1ms
Ukumelana ne-insulation	100MΩ,100V DC		Ingcindezi engaphezulu	2 izikhathi FS, ( 0C/0B/0A/02 5 izikhathi FS)
Isimo semvelo
Ukusebenza kwemidiya	Uketshezi olungagqwali ensimbini engagqwali kanye nerabha ye-nitrile	Ukushaqeka		Alukho ushintsho ku-10gRMS, (20～2000)Hz
Umthelela	100g, 11ms	Isikhundla		Phambuka ku-90° kunoma iyiphi indlela, shintsha uziro ≤ ±0.05%FS
Isimo esiyisisekelo
Izinga lokushisa kwemvelo	(25±1)℃	Umswakama		(50%±10%)RH
Umfutho womkhathi	(86~106) kPa	Ukunikezwa kwamandla kagesi		(1.5±0.0015) mA DC
Zonke izivivinyo zihambisana namazinga kazwelonke afanelekile, okuhlanganisa i-GB / T2423-2008, GB / T8170-2008, GJB150.17A-2009, njll., futhi kuthobelana nezinhlinzeko zeNkampani "ze-Pressure Sensor Enterprise Standards" zokuqukethwe okufanele.

Oda Amanothi

1. Ukuze ugweme ukungazinzi kwenzwa, sicela unake usayizi wokufaka nenqubo yokufaka ukuze ugweme ukucindezela inzwa yangaphambili phakathi namasekhondi angu-3 ukuze ugweme ukudluliswa kokushisa kwinzwa.

2. Uma usebenzisa iphinikhodi ye-cotter enegolide ocingweni, sicela usebenzise i-solder iron engaphansi kuka-25W ngaphansi kwezinga lokushisa eliphansi.

Uku-oda Ulwazi

I-XDB102-3
	Ikhodi yobubanzi	Ibanga lokulinganisa	Uhlobo lokucindezela	Ikhodi yobubanzi	Ibanga lokulinganisa	Uhlobo lokucindezela
	0B	0 ~ 20kPa	G	08	0~350kPa	G/A
	0A	0 ~ 35kPa	G	09	0~700kPa	G/A
	02	0 ~ 70kPa	G	10	0 ~ 1MPa	G/A
	03	0~100kPa	G/A	12	0 ~ 2MPa	G/A
	07	0~200kPa	G/A	13	0 ~ 3.5MPa	G/A
		Ikhodi	Uhlobo lokucindezela
		G	Umfutho wegeji
		A	Ukucindezela okuphelele
			Ikhodi	Ukuxhunywa kukagesi
			1	Iphinikhodi ye-kovar efakwe ngegolide
			2	I-100mm yerabha ye-Silicone ehamba phambili
				Ikhodi	Ukulinganisa okukhethekile
				Y	Uhlobo lomfutho wegeji lungasetshenziswa ukukala umfutho ongemuhle^①
I-XDB102-3 -0B-G-1-Y yonke imininingwane^②

Oda amanothi

2. Uma usebenzisa iphinikhodi ye-cotter enegolide ocingweni, sicela usebenzise i-solder iron engaphansi kuka-25W ngaphansi kwezinga lokushisa eliphansi.

Okwedlule: I-XDB102-2 Flush Diaphragm Pressure Sensor

Olandelayo: I-XDB103 Ceramic Pressure Sensor Module